Adhesives
Explore our range of high-quality adhesives designed to meet your diverse needs.
Bostik Adhesives
Bostik is a global leader in adhesive technologies, offering a wide range of innovative solutions for various industries.
Bostik emphasizes innovation and sustainability in its product development:
• Smart Adhesives: Designed to improve efficiency and performance in manufacturing processes.
• Eco-Friendly Products: Focus on reducing environmental impact through water-based and solvent-free formulations.
• Research and Development: Significant investment in R&D to create advanced adhesive technologies.
Bostik’s commitment to innovation, quality, and sustainability has made it a trusted name in adhesives worldwide, offering solutions that meet the evolving needs of customers and industries.
Bostik emphasizes innovation and sustainability in its product development:
• Smart Adhesives: Designed to improve efficiency and performance in manufacturing processes.
• Eco-Friendly Products: Focus on reducing environmental impact through water-based and solvent-free formulations.
• Research and Development: Significant investment in R&D to create advanced adhesive technologies.
Bostik’s commitment to innovation, quality, and sustainability has made it a trusted name in adhesives worldwide, offering solutions that meet the evolving needs of customers and industries.
Adhesives
BOSTIK HOT MELT ADHESIVES
Hot melt adhesives are thermoplastic materials that become liquid when heated and solidify upon cooling, creating strong bonds between various materials.
They are widely used due to their rapid bonding, ease of use, and ability to bond a range of substrates.
Adhesives
BORN2BOND™ HOT MELT PUR ADHESIVES
Hot Melt Polyurethane Reactive (HMPUR) Solutions have revolutionized the industry for over 25 years, with advancements and diverse product development driving their rapid growth.
Bostik’s innovative solutions are now integral to a wide range of applications, tailored to meet specific needs. Notably, Bostik AMPUR stands out as a versatile and ideal choice for the electronic device sector
Benefits of Hot Melt PUR
• Cures with moisture.
• Bonds effectively to a wide range of substrates.
• Offers a balanced combination of strength and elasticity.
• Suitable for bonding different types of materials.
• Low application temperature (110°C to 130°C).
• Resistant to temperature changes, humidity, and chemicals.
• Single-component formulation for a streamlined purchasing process.
• Provides immediate “green strength” upon cooling, even before full curing.
• Composed of 100% solids, eliminating volatile organic compounds (VOCs).
Benefits of Hot Melt PUR
• Cures with moisture.
• Bonds effectively to a wide range of substrates.
• Offers a balanced combination of strength and elasticity.
• Suitable for bonding different types of materials.
• Low application temperature (110°C to 130°C).
• Resistant to temperature changes, humidity, and chemicals.
• Single-component formulation for a streamlined purchasing process.
• Provides immediate “green strength” upon cooling, even before full curing.
• Composed of 100% solids, eliminating volatile organic compounds (VOCs).
Adhesives
BORN2BOND™ UV- Cure In Place Gasket
Bostik’s Born2Bond™ UV-Cure in Place Gasket (UV-CIPG) adhesive solution is an innovative gasket system widely used in applications demanding a quick, cost-effective solution,
particularly in electronics manufacturing and the automotive sector, as well as in general use.
This UV-CIPG method can be easily applied using an automated dispenser programmed to follow specific application areas.
This technique saves considerable time in preparing and applying the gasket onto product housings while reducing the material used in gasket manufacturing. The adhesive is cured using UV rays during application.
Born2Bond™ UV-CIPG represents Bostik’s latest advancement in engineering adhesives. It is designed to meet the precise bonding needs of modern consumer electronics and automotive industries.
This UV-CIPG method can be easily applied using an automated dispenser programmed to follow specific application areas.
This technique saves considerable time in preparing and applying the gasket onto product housings while reducing the material used in gasket manufacturing. The adhesive is cured using UV rays during application.
Born2Bond™ UV-CIPG represents Bostik’s latest advancement in engineering adhesives. It is designed to meet the precise bonding needs of modern consumer electronics and automotive industries.
Adhesives
BORN2BOND™ Cynoacrylate Technologies
The initial lineup of Born2Bond™ products consists of instant engineering adhesives. Traditionally, the performance and applications of these adhesives have been restricted by the limitations of existing cyanoacrylate technologies.
Bostik aims to overcome these limitations through a unique process, creating a range of instant adhesives that offer the high-performance and user-friendly qualities that engineers require.
Benefits:
• Low odor
• Low blooming
• High performance
Bostik aims to overcome these limitations through a unique process, creating a range of instant adhesives that offer the high-performance and user-friendly qualities that engineers require.
Benefits:
• Low odor
• Low blooming
• High performance
Adhesives
BORN2BOND™ Water Based Adhesive
Industrial adhesives are utilized across a range of industries, from packaging and leather goods to automotive applications.
Among the many adhesive options available, water-based adhesives stand out as an environmentally friendly choice for companies aiming to promote safer work environments.
Bostik is committed to environmental responsibility and the well-being of our customers.
That’s why we have invested in developing eco-friendly, water-based construction adhesives that feature low odor and minimal Volatile Organic Compounds (VOCs).
Among the many adhesive options available, water-based adhesives stand out as an environmentally friendly choice for companies aiming to promote safer work environments.
Bostik is committed to environmental responsibility and the well-being of our customers.
That’s why we have invested in developing eco-friendly, water-based construction adhesives that feature low odor and minimal Volatile Organic Compounds (VOCs).
Adhesives
BOSTIK THERMELT LOW PRESSURE MOLDING SOLUTION
Low Pressure Molding (LPM) technology is essential for encapsulating electronic components, providing protection and sealing against moisture, dust, dirt, and debris.
LPM streamlines the process into a single, rapid procedure, combining elements of traditional plastic injection and resin potting.
It is particularly well-suited for connectors, onboard electronics, LEDs, and printed circuit boards (PCBs).
Our LPM solutions include Thermelt, a versatile range of hot melt polyamide adhesives tailored to meet specific customer requirements. These adhesives are designed for multipurpose use, with high resistance to temperature and oil.
They are easy to process at low pressures and temperatures, making them suitable for encapsulating even delicate, sensitive electronics in demanding environments.
Additionally, we produce reactive polyamides (PAR) that can endure temperatures up to 200°C. We also offer formulations with enhanced cohesion and higher thermal stability for specialized applications.
It is particularly well-suited for connectors, onboard electronics, LEDs, and printed circuit boards (PCBs).
Our LPM solutions include Thermelt, a versatile range of hot melt polyamide adhesives tailored to meet specific customer requirements. These adhesives are designed for multipurpose use, with high resistance to temperature and oil.
They are easy to process at low pressures and temperatures, making them suitable for encapsulating even delicate, sensitive electronics in demanding environments.
Additionally, we produce reactive polyamides (PAR) that can endure temperatures up to 200°C. We also offer formulations with enhanced cohesion and higher thermal stability for specialized applications.
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